Constructions comprising insulative materials

ABSTRACT

The invention encompasses methods of forming insulating materials between conductive elements. In one aspect, the invention includes a method of forming a material adjacent a conductive electrical component comprising: a) partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. In another aspect, the invention includes a method of forming a material between a pair of conductive electrical components comprising the following steps: a) forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; b) forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and c) vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. In another aspect, the invention includes an insulating material adjacent a conductive electrical component, the insulating material comprising a matrix and at least one void within the matrix. In another aspect, the invention includes an insulating region between a pair of conductive electrical components comprising: a) a support member between the conductive electrical components, the support member not comprising a conductive interconnect; and b) at least one void between the support member and each of the pair of conductive electrical components.

RELATED PATENT DATA

This patent resulted from a continuation application of U.S. patentapplication Ser. No. 08/947,847 filed Oct. 9, 1997 now U.S. Pat. No.6,333,556 B1, issued Dec. 25, 2001.

TECHNICAL FIELD

The invention pertains to methods of forming material adjacentelectrical components and to methods of forming material betweenconductive electrical components. The invention further pertains toinsulating materials formed adjacent or between conductive electricalcomponents.

BACKGROUND OF THE INVENTION

A prior art semiconductor wafer fragment 10 is illustrated in FIG. 1.Wafer fragment 10 comprises a substrate 12 and conductive electricalcomponents 14, 16 and 18 overlying substrate 12. Conductive electricalcomponents 14, 16 and 18 may comprise, for example, conductive lines.Such conductive lines may be formed from metal, or conductively-dopedpolysilicon. Between conductive components 14, 16 and 18 is formed aninsulative material 20. Material 20 electrically isolates conductiveelements 14, 16 and 18 from one another. Insulative material 20 maycomprise materials known to persons of ordinary skill in the art,including, for example, silicon dioxide, silicon nitride, and undopedsilicon. Although each of these materials has good insulativeproperties, the materials disadvantageously have high dielectricconstants which can lead to capacitive coupling between proximateconductive elements, such as elements 14, 16 and 18. For instance,silicon nitride has a dielectric constant of about 8 and undoped siliconhas a dielectric constant of about 11.8.

A prior art method for insulating conductive elements 14, 16 and 18 fromone another, while reducing a dielectric constant of a material betweenconductive elements 14, 16 and 18 is illustrated in FIGS. 2 and 3. Inreferring to FIGS. 2 and 3, similar numbers to those utilized in FIG. 1will be used, with differences indicated by the suffix “a” or bydifferent numerals.

Referring to FIG. 2, a semiconductor wafer fragment 10 a is illustrated.Fragment 10 a comprises a substrate 12 a, and overlying conductive lines14 a, 16 a and 18 a. Between lines 14 a, 16 a and 18 a is a carbon layer22. Conductive lines 14 a, 16 a and 18 a are inlaid within carbon layer22 by a damascene method. A thin, gas-permeable, silicon dioxide layer24 is formed over conductive lines 14 a, 16 a and 18 a, and over carbonlayer 22.

Referring to FIG. 3, carbon layer 22 is vaporized to form voids 26between conductive elements 14 a, 16 a and 18 a. Voids 26 contain a gas.Gasses advantageously have dielectric constants of about 1.

It would be desirable to develop alternative methods for insulatingconductive elements from one another with low-dielectric-constantmaterials.

SUMMARY OF THE INVENTION

The invention encompasses methods of forming insulating materialsbetween conductive elements. The invention pertains particularly tomethods utilizing low-dielectric-constant materials for insulatingconductive elements, and to structures encompassinglow-dielectric-constant materials adjacent or between conductiveelements.

In one aspect, the invention encompasses a method of forming a materialadjacent a conductive electrical component. The method includesproviding a mass adjacent the conductive electrical component andpartially vaporizing the mass to form a matrix adjacent the conductiveelectrical component. The matrix can have at least one void within it.

In another aspect, the invention encompasses a method of forming amaterial adjacent a conductive electrical component which includesproviding a mass comprising polyimide or photoresist adjacent theconductive electrical component. The method further includes at leastpartially vaporizing the mass.

In another aspect, the invention encompasses a method of forming amaterial between a pair of conductive electrical components. The methodincludes forming at least one support member between the pair ofconductive electrical components. The method further includes providinga mass between the at least one support member and each of the pair ofconductive electrical components. Additionally, the method includesvaporizing the mass to a degree effective to form at least one voidbetween the support member and each of the pair of conductive electricalcomponents.

In yet another aspect, the invention encompasses an insulating materialadjacent a conductive electrical component. The insulating materialcomprises a matrix and at least one void within the matrix.

In yet another aspect, the invention encompasses an insulating regionbetween a pair of conductive electrical components. The insulatingregion comprises a support member between the conductive electricalcomponents, the support member not comprising a conductive interconnect.The insulating region further comprises at least one void between thesupport member and each of the pair of conductive electrical components.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a diagrammatic cross-sectional view of a prior artsemiconductor wafer fragment.

FIG. 2 is a diagrammatic cross-sectional view of a semiconductor waferfragment at a preliminary step of a prior art processing method.

FIG. 3 is a view of the FIG. 2 wafer fragment at a prior art processingstep subsequent to that of FIG. 2.

FIG. 4 is a diagrammatic cross-sectional view of a semiconductor waferfragment at a preliminary step of a processing method of the presentinvention.

FIG. 5 is a view of the FIG. 4 wafer fragment shown at a processing stepsubsequent to that of FIG. 4.

FIG. 6 is a view of the FIG. 4 wafer fragment shown at a step subsequentto that of FIG. 5.

FIG. 7 is a diagrammatic cross-sectional view of a semiconductor waferfragment at a preliminary processing step according to second embodimentof the present invention.

FIG. 8 is a view of the FIG. 7 wafer fragment shown at a step subsequentto that of FIG. 7.

FIG. 9 is a diagrammatic cross-sectional view of a semiconductor waferfragment processed according to a third embodiment of the presentinvention.

FIG. 10 is a diagrammatic cross-sectional view of a semiconductor waferfragment at a preliminary step of a processing sequence according to afourth embodiment of the present invention.

FIG. 11 is a view of the FIG. 10 wafer fragment shown at a processingstep subsequent to that of FIG. 10.

FIG. 12 is a view of the FIG. 10 wafer fragment shown at a processingstep subsequent to that of FIG. 11.

FIG. 13 is a diagrammatic cross-sectional view of a semiconductor waferfragment processed according to a fifth embodiment of the presentinvention.

FIG. 14 is a diagrammatic cross-sectional view of a semiconductor waferfragment processed according to a sixth embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws “to promote the progressof science and useful arts” (Article 1, Section 8).

A first embodiment of the present invention is described with referenceto FIGS. 4-6. In describing the first embodiment, like numerals from thepreceding discussion of the prior art are utilized where appropriate,with differences being indicated by the suffix “b” or by differentnumerals.

Referring to FIG. 4, a semiconductor wafer fragment 10 b is illustrated.Semiconductor wafer fragment 10 b comprises a substrate 12 b, andconductive elements 14 b, 16 b and 18 b overlying substrate 12 b.Conductive elements 14 b, 16 b and 18 b may comprise, for example,conductive lines. Substrate 12 b may comprise, for example, aninsulative layer over a semiconductive substrate.

Electrical components 14 b, 16 b and 18 b are horizontally displacedfrom one another, with electrical components 14 b and 18 b beinglaterally outwardly displaced from component 16 b. A mass 30 is betweenelectrical components 14 b and 16 b, and between electrical components16 b and 18 b. Mass 30 is also outwardly adjacent outer conductiveelements 14 b and 18 b.

Mass 30 is preferably an insulative material and may comprise, forexample, carbon. Alternatively, by way of example only, mass 30 cancomprise polyimide or photoresist. In yet other alternative aspects ofthe invention, mass 30 can comprise a mixture of a material which issubstantially non-vaporizable under selected conditions, and a materialwhich is substantially vaporizable under the selected conditions.Accordingly, complete vaporization of the substantially vaporizablematerial under the selected conditions will only partially vaporize mass30. As an example, mass 30 can comprise a mixture of carbon and silicondioxide. As another example, mass 30 can comprise a mixture of carbonand SiC_(x). Preferably, if mass 30 comprises SiC_(x), “x” will be fromabout 0.2 to about 1.5. More preferably, if mass 30 comprises a mixtureof carbon and SiC_(x), mass 30 will comprise a mixture from about 20% toabout 80% carbon, by volume, and from about 80% to 20% SiC_(x), byvolume, wherein “x” is from about 0.2 to about 1.5.

As will be recognized by persons of ordinary skill in the art, theconstruction of FIG. 4 may be formed by a number of different methods.For instance, conductive elements 14 b, 16 b and 18 b could be formedfirst, and mass 30 subsequently deposited over and between conductiveelements 14 b, 16 b and 18 b. Mass 30 could then be planarized to alevel approximately equal with upper surfaces of conductive elements 14b, 16 b and 18 b.

As another example, mass 30 could be deposited between an adjacentconductive lines 14 b, 16 b and 18 b, without being deposited overconductive lines 14 b, 16 b and 18 b.

In yet another example, mass 30 could first be formed over substrate 12b, and subsequently conductive elements 14 b, 16 b and 18 b could beformed within mass 30 by a damascene method. Conductive electricalcomponents 14 b, 16 b and 18 b would thereby effectively be formedwithin an expanse of mass 30.

If mass 30 comprises carbon, the carbon may be deposited by plasmadecomposition of C(n)H(2n) or C(n)H(2n)X(n), wherein “X” is a halogensuch as Br, Cl, I, etc. The deposited carbon is preferably about 10,000Angstroms thick and can be porous. Porosity of a deposited carbon layercan be adjusted by adjusting deposition parameters, such as, plasmapower, temperature, pressure, etc.

Referring to FIG. 5, a layer 32 is formed over mass 30, and overconductive elements 14 b, 16 b and 18 b. Layer 32 preferably comprises agas permeable insulative material and may comprise, for example, silicondioxide. Layer 32 will preferably be relatively thin, such as about 500Angstroms thick. If layer 32 comprises silicon dioxide, the layer may beformed, for example, by sputter deposition. As will be discussed below,mass 30 can be partially or substantially totally vaporized afterprovision of layer 32. Preferably, layer 32 and mass 30 comprisematerials which permit mass 30 to be partially or substantially totallyvaporized under conditions which do not vaporize layer 32.

Referring to FIG. 6, mass 30 (shown in FIG. 5) is partially vaporized toform a matrix 34 between conductive elements 14 b, 16 b and 18 b. Matrix34 is also formed outwardly adjacent outer conductive elements 14 b and18 b. Matrix 34 can alternatively be referred to as a web, skeleton orscaffolding.

The partial vaporization of mass 30 (shown in FIG. 5) can beaccomplished by exposing wafer fragment 10 b to an oxidizing ambient ata temperature of from about 200° C. to about 400° C. Appropriateoxidizing ambients include, for example, O₃ , plasma O₃ , H₂O₂, plasmaH₂O₂, combinations of O₃ and H₂O₂, and combinations of plasma O₃ andH₂O₂. It is thought that the partial vaporization of mass 30 occurs asexcited oxygen atoms diffuse through material 32 and volatize material34. For instance, if material 34 comprises carbon, the material will beconverted into a gas comprising CO₂ and/or CO, which can diffuse outthrough layer 32.

Matrix 34 comprises voids 36. If pores were originally present in layer30, such pores can expand as mass 30 is vaporized to form voids 36.Preferably, matrix 34 comprises at least one void 36 between each pairof conductive elements. Typically, matrix 34 will comprise a pluralityof voids 36 between each pair of conductive elements. The voids andpartially vaporized material of matrix 34 provide an insulative materialbetween conductive lines 14 b and 16 b, and between conductive lines 16b and 18 b, which preferably has a decreased dielectric constantrelative to mass 30 (shown in FIG. 5). Accordingly, the conversion ofmass 30 to partially vaporized matrix 34 can advantageously decreasecapacitive coupling between paired conductive elements 14 b and 16 b,and between paired conductive elements 16 b and 18 b. Preferably, matrix34 has a dielectric constant of less than or equal to about 2.

An advantage of the embodiment discussed above with reference to FIGS.4-6, relative to the prior art method discussed in the “Background”section, is that matrix 34 provides a skeletal support structure in theembodiment of the present invention. Such skeletal support structure canassist in supporting layer 32 over an expanse between paired conductiveelements 14 b and 16 b, and over an expanse between paired conductiveelements 16 b and 18 b. Also, matrix 34 can assist in supporting layer32 outwardly adjacent outer conductive elements 14 b and 18 b. Further,due to the supporting properties of matrix 34, layer 32 may be formedeither before or after partial vaporization of mass 30 (shown in FIG.5).

A second embodiment of the present invention is described with referenceto FIGS. 7-8. In describing the second embodiment, like numerals fromthe preceding discussion of the first embodiment are utilized, withdifferences being indicated by the suffix “c” or with differentnumerals.

Referring to FIG. 7, a semiconductor wafer fragment 10 c is illustrated.Wafer fragment 10 c comprises a substrate 12 c. Conductive electricalcomponents 14 c, 16 c and 18 c overlie substrate 12 c. Electricalcomponents 14 c, 16 c and 18 c are horizontally displaced from oneanother, with electrical components 14 c and 18 c being outwardlydisplaced from component 16 c. A mass 30 c is between electricalcomponents 14 c and 16 c, and between electrical components 16 c and 18c. Mass 30 c is also outwardly adjacent outer conductive elements 14 cand 18 c. Mass 30 c does not comprise carbon, and preferably compriseseither polyimide or photoresist. Substrate 12 c may comprise, forexample, an insulative material over a semiconductive wafer. Conductiveelements 14 c, 16 c and 18 c may comprise, for example, metal lines.

A layer 32 c is formed over mass 30 c, and over conductive elements 14c, 16 c and 18 c. Layer 32 c preferably comprises an insulativematerial, and may comprise, for example, silicon dioxide. The structureof FIG. 7 is quite similar to the structure of FIG. 5, and may thereforebe formed by methods such as those discussed above regarding FIG. 5,with the exception that mass 30 c will not comprise carbon.

Referring to FIG. 8, mass 30 c (shown in FIG. 7) is substantiallytotally vaporized to form voids 36 c between conductive elements 14 c,16 c and 18 c, and outwardly adjacent outer conductive elements 14 c and18 c. Mass 30 c can be substantially totally vaporized by exposing wafer10 c to an oxidizing ambient at a temperature of from about 200° C. toabout 400° C. The difference between whether a mass, such as mass 30 ofFIG. 5, or mass 30 c of FIG. 7, is partially vaporized (as shown in FIG.6) or substantially totally vaporized (as shown in FIG. 8) can bedetermined by the time of exposure of a wafer fragment, such as 10 b or10 c, to an oxidizing ambient at a temperature of from about 200° C. toabout 400° C. Such times are readily determinable by persons of ordinaryskill in the art.

The second embodiment of the present invention (discussed above withreference to FIGS. 7 and 8) differs from the prior art method ofdiscussed above in the Background section in that the second embodimentutilizes an insulative layer 30 c which does not comprise carbon, suchas a layer of photoresist or polyimide. Such use of photoresist orpolyimide insulative layers offers distinct advantages over the priorart use of carbon insulative layers. For instance, while carbon istypically applied by vapor deposition techniques, polyimide andphotoresist can be applied by spin-on-wafer techniques. Spin-on-wafertechniques enable the polyimide or photoresist to be applied with arelatively planar upper surface. Such planar upper surface can eliminateplanarization processes from some applications of the present inventionwhich would otherwise require planarization processes.

Also, spin-on-wafer techniques offer an advantage in that a solvent canbe incorporated into a spin-on-wafer applied layer. Such solvent can bevaporized or otherwise removed from the applied layer duringvaporization of the applied layer to increase the size or amount ofvoids formed within the applied layer. The amount of solventincorporated into a spin-on-wafer applied layer can be controlled byvarying the amount and type of solvent utilized during a spin-on-waferapplication of a layer. For instance, a first relatively volatilesolvent and a second relatively non-volatile solvent could both beutilized during a spin-on-wafer application. The first solvent wouldlargely evaporate from an applied layer during formation of the layerwhile the second solvent would substantially remain within the appliedlayer.

FIG. 9 illustrates a third embodiment of the present invention. Indescribing the third embodiment, like numerals from the precedingdiscussion of the second embodiment are utilized, with differences beingindicated by the suffix “d” or with different numerals.

Referring to FIG. 9, a wafer fragment 10 d comprises a substrate 12 dand conductive elements 14 d, 16 d and 18 d overlying substrate 12 d. Alayer 32 d overlies conductive elements 14 d, 16 d and 18 d. Voids 36 dare formed between conductive elements 14 d, 16 d and 18 d. Voids 36 dcan be formed, for example, by methods analogous to those discussedabove with reference to FIGS. 7 and 8, or by methods utilizingsubstantially total vaporization of a carbon-comprising material.

Wafer fragment 10 d further comprises support members 38 formed betweenconductive elements 14 d and 16 d, and between conductive elements 16 dand 18 d. Support members 38 can advantageously assist in supportinglayer 32 d over the voids 35d between conductive elements 14 d, 16 d,and 18 d. Support members 38 may comprise either insulative material orconductive material, but preferably do not comprise a conductiveinterconnect. Accordingly, support members 38 are preferablyelectrically isolated from conductive elements 14 d, 16 d and 18 d, aswell as from other conductive structures which may be comprised by anintegrated circuit formed on wafer fragment 10 d.

Support members 38 can be formed by methods readily apparent to personsof ordinary skill in the art. An example method comprises formingsupport members 38 between conductive elements 14 d, 16 d and 18 d andsubsequently forming a mass, such as mass 30 of FIG. 5 or mass 30 c ofFIG. 7 between the support members and conductive elements. Layer 32 dcould be then formed over the mass, over conductive elements 14 d, 16 dand 18 d, and over support members 38. Next, the mass could be eitherpartially or substantially totally vaporized to leave voids, such asvoids 36 d, between support members 38 and conductive elements 14 d, 16d and 18 d.

An alternative method of forming support members 38 would compriseforming the support members within an expanse of a mass, such as themass 30 of FIG. 5, or the mass 30 c of FIG. 7, by a damascene method.

It is noted that structure 38 may be utilized with either methods ofpartial vaporization of insulative materials, such as the methoddescribed with reference to FIGS. 4-6, or with methods of substantiallytotal vaporization of insulative materials, such as the method discussedabove with reference to FIGS. 7-8.

A fourth embodiment of the present invention is described with referenceto FIGS. 10-12. In describing the fourth embodiment, like numerals fromthe preceding discussion of the first embodiment are utilized whereappropriate, with differences being indicated with the suffix “e” orwith different numerals.

Referring to FIG. 10, a semiconductor wafer fragment 10 e isillustrated. Wafer fragment 10 e comprises a substrate 12 e andconductive elements 14 e, 16 e, 18 e and 40 overlying substrate 12 e. Amass 30 e is formed over conductive elements 14 e, 16 e, 18 e and 40, aswell as between the conductive elements. Mass 30 e preferably comprisesan insulative material, and can comprise materials such as thosediscussed above regarding mass 30 (shown in FIG. 4). Mass 30 e extendsentirely from conductive element 14 e to conductive element 16 e,entirely from conductive element 16 e to conductive element 18 e, andentirely from conductive element 18 e to conductive element 40.

Referring to FIG. 11, mass 30 e is anisotropically etched to remove mass30 e from over conductive elements 14 e, 16 e, 18 e and 40, and to isremove mass 30 e from between conductive elements 18 e and 40. Theanisotropic etching forms spacers 42 from mass 30 e adjacent conductiveelement 40 and adjacent conductive elements 14 e and 18 e.

After the anisotropic, etching mass 30 e extends entirely fromconductive element 14 e to conductive element 16 e and entirely fromconductive element 16 e to conductive element 18 e, but no longerextends entirely from conductive element 18 e to conductive element 40.

As will be recognized by persons of ordinary skill in the art, methodsfor anisotropically etching mass 30 e will vary depending on thechemical constituency of mass 30 e. Such methods will be readilyrecognized by persons of ordinary skill in the art. An example methodfor anisotropically mass 30 e when mass 30 e comprises carbon is aplasma etch utilizing O₂.

A layer 32 e is formed over spacers 42, over mass 30 e, and overconductive elements 14 e, 16 e, 18 e and 40. Layer 32 e preferablycomprises a material porous to gas diffusion, such as a silicon dioxidelayer having a thickness of about 500 Angstroms or less.

Referring to FIG. 12, mass 30 e (shown in FIG. 11) is substantiallytotally vaporized to form voids 36 e. After such substantially totalvaporization of mass 30 e, spacers 42 comprise an insulative space.Methods for substantially totally vaporizing mass 30 e can includemethods discussed above with reference to FIGS. 8 and 9.

A fifth embodiment of the present invention is described with referenceto FIG. 13. In describing the fifth embodiment, like numerals from thepreceding discussion of the fourth embodiment are utilized whereappropriate, with differences being indicated by the suffix “f” or bydifferent numerals.

Referring to FIG. 13, a wafer fragment 10 f is illustrated. Waferfragment 10 f comprises a substrate 12 f, and conductive electricalcomponents 14 f, 16 f, 18 f and 40 f overlying substrate 12 f. Aninsulative material 32 f overlies components 14 f, 16 f, 18 f, 40 f, andsubstrate 12 f. Wafer fragment 10 f is similar to the wafer fragment 10e of FIG. 12, and may be formed by similar methods. Wafer fragment 10 fdiffers from the wafer fragment 10 e of FIG. 12 in that wafer fragment10 f comprises a matrix 34 f of partially vaporized material. Matrix 34f can be formed from the mass 30 e of FIG. 11 utilizing methodsdiscussed above with reference to FIG. 6. Matrix 34 f comprises voids 36f.

Wafer fragment 10 f further comprises spacers 42 f adjacent conductiveelements 14 f, 18 f and 40 f, with spacers 42 f comprising matrix 34 fand at least one void 36 f.

It is noted that in forming the fifth embodiment of FIG. 13, material 32f may be formed either before or after formation of matrix 34 f.

A sixth embodiment of the present invention is described with referenceto FIG. 14. In describing the sixth embodiment, like numerals from thepreceding discussion of the first five embodiments are utilized whereappropriate, with differences being indicated by the suffix “g” or bydifferent numerals.

Referring to FIG. 14, a wafer fragment 10 g is illustrated. Waferfragment 10 g comprises a substrate 12 g and conductive elements 50, 52,54, 56, 58, 60, 62 and 64. Unlike the first five embodiments, the sixthembodiment of FIG. 14 comprises conductive elements which are verticallydisplaced from one another, for example, elements 50, 52 and 54, as wellas conductive elements which are horizontally displaced from each other,for example, conductive elements 54, 56 and 58. Over conductive elements52, 54, 56, 58, 60, 62 and 64 is a gas permeable insulative layer 32 g.

Wafer fragment 10 g further comprises voids 36 g adjacent and betweenconductive elements 50, 52, 54, 56, 58, 60, 62 and 64. Voids 36 g may beformed utilizing the methods discussed above regarding the first fiveembodiments of the invention. For example, voids 36 g may be formed byproviding a mass, analogous to mass 30 c of FIG. 7, adjacent and betweenconductive elements 50, 52, 54, 56, 58, 60, 62 and 64, and subsequentlysubstantially totally vaporizing the mass to form voids 36 g.Alternatively, voids 36 g could be formed within a matrix (not shown)analogous to matrix 34 of FIG. 6 utilizing methods such as thosediscussed above with reference to FIGS. 6 and 13. For instance, a massanalogous to mass 30 of FIG. 5 may be formed adjacent and betweenconductive elements 50, 52, 54, 56, 58, 60, 62 and 64 and subsequentlypartially vaporized to form a matrix adjacent and between the conductiveelements.

Wafer fragment 10 g further comprises support members 70, 72, 74, 76 and78. Support members 70, 72, 74, 76 and 78 may be formed by methodsanalogous to the methods discussed above for forming support member 38with reference to FIG. 9. Support members 70, 72, 74, 76 and 78preferably comprise sizes and shapes analogous to conductive elementsformed at a common elevational level with the support members.Accordingly, support members 70 preferably comprise sizes and shapesanalogous to that of conductive element 50; support members 72preferably comprise sizes and shapes analogous to that of conductiveelement 52; support members 74 preferably comprise sizes and shapesanalogous to those of conductive elements 54, 56 and 58; support members76 preferably comprise sizes and shapes similar to that of conductiveelement 60; and support members 78 preferably comprise sizes and shapessimilar to those of conductive elements 62 and 64. Such advantageoussimilarity of the sizes and shapes of support members with sizes andshapes of conductive elements at similar elevational levels to thesupport members can advantageously assist in maintaining a substantiallyplanar upper layer 32 g.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. A construction comprising an electricallyinsulative material between a pair of conductive electrical components,the insulative material comprising a matrix of non-gaseous material andat least one void within the matrix, the matrix comprising carbon havingSiC_(x) dispersed therein, wherein “x” is from 0.2 to 0.5.
 2. Theconstruction of claim 1 wherein the matrix comprises from about 20% toabout 80% carbon, by volume, and from about 80% to about 20% SiC_(x), byvolume.
 3. The construction of claim 1 wherein the insulative materialand pair of conductive electrical components are over a semiconductivesubstrate.
 4. A construction comprising an electrically insulativematerial between at least two conductive electrical components, theinsulative material comprising a mass of carbon having SiC_(x) dispersedtherein, wherein “x” is from 0.2 to 0.5.
 5. The construction of claim 5wherein the mass comprises from about 20% to about 80% carbon, byvolume, and from about 80% to about 20% SiC_(x), by volume.
 6. Theconstruction of claim 5 wherein the insulative material